Die Per Wafer Calculator
Use our calculator to estimate how many individual dies can be cut from a single wafer. Simply fill out the wafer and die size, then click “calculate” to get your results, including wafer area, die area, gross dies, usable dies, net dies, die yield, and dies per cm2.
Wafer & Die Parameters
Calculation Results
Wafer Area: -
Die Area: -
Gross Dies: -
Usable Dies (with edge loss): -
Net Dies (after defects): -
Die Yield: -
Dies per cm²: -
Wafer Layout Visualization
Blue squares represent usable dies, gray area shows edge exclusion
Formulas Used
Basic Formula:
Gross Dies = (π × d²) / (4 × Die Area)
Gross Dies = (π × d²) / (4 × Die Area)
Improved Formula with Edge Loss:
Usable Dies = Gross Dies - (π × d) / (√2 × √Die Area)
Usable Dies = Gross Dies - (π × d) / (√2 × √Die Area)
Yield Formula:
Net Dies = Usable Dies × e^(-Die Area × Defect Density)
Net Dies = Usable Dies × e^(-Die Area × Defect Density)
Promex offers a full suite of die preparation services designed to transform semiconductor wafers into high-performance packaged devices. Learn more about our capabilities.