“Die Attach Film Applications” By Promex CTO Annette Teng
Published in MEPTEC Report Winter 2016
Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material available for die-attach, an integral part of component assembly, in particular for wire-bonded devices, but not quite applicable for flip-chip assembly. In this white paper, DAF is shown to be well established as a standard die attach material and can also work as a lid seal material for open cavity panels. Many types of DAF, including silver-filled electrically conductive, diamond-filled thermally conductive as well as non-conductive DAF for various complex microelectronic assemblies have been successfully implemented.
Here’s a downloadable version (.pdf) of the paper:
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