Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding fiber-to-photonic IC alignment, thermal mitigation, and optical testing strategies. Our CEO Dick Otte discusses thermal mitigation and fiber alignment challenges in this Semiconductor Engineering article.
Promex
Complex Microelectronic Assembly Experts
Co-Packaged Optics Reaches Power Efficiency Tipping Point
