Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a...
“Die Attach Film Applications” By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy...
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014. Here’s a downloadable version (.pdf) of the paper: Getting Started Concept to...
“Development Status of an OCCAM Electronic Assembly Method” by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014. Here’s a downloadable version (.pdf) of the paper: Getting Started Concept to...
“A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs...
Join us on November 20, 2024 at 5 PM for a fun evening of Mexican flavor with a Bay Area-influence: Tequila Signature Sangria, Tasty Tacos & Treats, and Tours of our Facility!
