Jan 18, 2024 | Media Coverage
The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...
Nov 29, 2023 | Media Coverage
Advances in integrated microelectronics have enabled a revolution in ever smaller and more powerful medical sensors. One such use is for detecting pressure in the eye. InjectSense has invented an implantable sensor that detects direct dynamic pressure in the eye and...
Oct 19, 2023 | Media Coverage
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management...
Oct 19, 2023 | Media Coverage
Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the...
Sep 28, 2023 | Media Coverage
Some complexities of integrating miniaturized components, such as microelectronics, into increasingly small medical devices are obvious. Examples include the precision required to position and align components with the requisite accuracy, or the identification...
Sep 21, 2023 | Media Coverage
The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what...
