Aug 21, 2024 | Media Coverage
The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...
Aug 15, 2024 | Media Coverage
High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...
Aug 8, 2024 | Media Coverage
Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...
Aug 1, 2024 | Media Coverage
Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...
Jul 23, 2024 | Media Coverage
The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...
Jul 11, 2024 | Media Coverage
Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head of...
