Apr 4, 2024 | Media Coverage
With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production. Dave...
Mar 21, 2024 | Media Coverage
Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed and...
Mar 4, 2024 | Media Coverage
Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...
Feb 26, 2024 | Media Coverage
The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...
Jan 31, 2024 | Media Coverage
In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...
Jan 18, 2024 | Media Coverage
The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...
