Our wafer processing capabilities include backgrinding, die-attach film (DAF) application, sawing/singulation, and precision die attach with epoxy curing or flip chip reflow. We follow up with plasma cleaning, wire bonding, and encapsulation, ready for further special processing as required.

Whether your device needs to incorporate fluid seals, optical filters, image sensors, or MEMS, we handle specialized parts with tailored processes. Your project moves seamlessly from specialized part placement to final testing, ensuring a efficient path to market success.

• • Gold Ball
  • Aluminum Wedge
  • Ribbon
  • Au Wire, 0.6 to 2.0 mils

Encapsulation shields delicate microelectronic components in applications. It ensures protection against environmental factors, ensuring reliability, safety, and long-term functionality in sensitive devices.

• • Dam and Fill
  • Air Cavity / Lid
  • Over Mold
  • Microfluidic Options

Singulation is the process of separating interconnected microelectronic components into individual parts. It ensures individual functionality and seamless integration for optimal performance and reliability.

Laser marking employs focused beams to engrave codes or patterns on microelectronic components for a variety of purposes. It ensures traceability, authentication, and durability for quality control and compliance.

• • Flip Chip
  • Thermo Compression Bonding (TCB)
  • Underfill
  • Epoxy Lid Attach

Epoxy dispense involves accurately applying adhesive material onto microelectronic components in medical devices or biotech devices. This ensures secure bonding, thermal management, and protection from the environment to ensure reliable functionality in demanding applications.

Wafer dicing is the process of cutting a semiconductor wafer into individual chips. It’s integral to microelectronic assembly, enabling precise creation of components for various devices, from smartphones to sensors. Promex has some of the most experienced wafer dicing operators in the nation and can work with you to take on your most challenging projects and needs.

Wafer backgrinding involves thinning a semiconductor wafer’s backside to enhance flexibility and reduce thickness. It’s crucial for producing ultra-thin chips in intricate microelectronic assembly, optimizing space and performance.

• • Wafer Backgrinding Down to 30 µm
  • Wafer Dicing
  • Dice Before Grind
  • Die Attach Film (DAF) Expertise
  • Up to 300 mm
  • Multi-project Wafers

Processes, materials, and tooling will be developed and selected as part of the development and optimization process. The deliverable is a refined manufacturing procedure with recipes, tooling, and the equipment necessary to fabricate the desired product with a consistency and cost that meets the business needs. This package is suitable for the process validation activities of Phase 02 with minimal, if any, changes. Process Failure Mode and Effects Analysis (PFMEA) is started.

At least three lots are built using the process from Phase 01. All devices meet requirements defined in Phase 01 for the process to be validated. The PFMEA is finalized, and the Process Control Plan is generated. Operational qualification (OQ) and performance qualification (PQ) protocols are written and executed.

Preproduction is a transition state where production-level practices are followed while some of the quality deliverables and documentation are completed. First Article Inspection Report (FAIR) is completed, and reports are submitted to customer for approval.

In this final phase, the processes to fabricate an assembly have been developed, validated, and fully documented to both companies’ satisfaction. The only remaining activity is to accept orders, build product, track yields, and report back to the customer as required.