Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption. One of the main reasons for the cost increase is the need for advanced packaging when employing chiplets, which represents a fundamental shift in how semiconductors are designed, built, and tested.
In this Semiconductor Engineering article, Promex COO Dave Fromm weighs in on factors contributing to rising costs, as well as limitations beyond costs.