Semiconductor chips, including microelectromechanical systems (MEMS), have revolutionized sensors in recent times. The inclusion in sensors of these miniature semiconductor and mechanical devices enables detection, analysis, communication and physical motion functions. These capabilities are of use in many applications, from consumer electronics, to automotive, healthcare, and aerospace. However, the successful integration of chips and MEMS into sensors and other functional devices requires overcoming significant packaging and assembly challenges. In this Chip Scale Review article, our CEO Dick Otte explores some of these multifaceted challenges, highlighting the impact of heterogeneous integration (HI) on enhancing device performance, reliability, and functionality.
Read the full article on page 31 here.