Military & Aerospace
Promex and our semiconductor packaging division, QP Technologies, have been serving the U.S. defense and aerospace industry for many years. As one of the few U.S.-based microelectronic component assembly contract manufacturers that retain all design and manufacturing within the United States, our state-of-the-art facilities and equipment are ready to serve the U.S. defense industry’s many innovative projects focused on microelectronics.
Market Trends
Military and aerospace industries rely on advanced microelectronics to power mission-critical systems, from secure communications and avionics to radar, navigation, and defense technologies. As modern warfare and space exploration evolve, there is increasing demand for high-performance, reliable electronic components that can withstand extreme environmental conditions, including high radiation, temperature fluctuations, and mechanical stress.
The global push for enhanced defense capabilities, including next-generation fighter jets, unmanned aerial vehicles (UAVs), and satellite-based surveillance, is driving innovation in semiconductor packaging, heterogeneous integration, and advanced manufacturing techniques. The rise of electronic warfare and cyber defense has also accelerated the need for secure, ITAR-compliant microelectronics that ensure data integrity and operational security in critical applications.
One of the most significant trends in military and aerospace electronics is the transition toward miniaturization and lightweight designs. As aircraft, spacecraft, and defense systems become more complex, reducing size, weight, and power consumption is a top priority. Advanced sensor systems, high-frequency RF communication, and optical targeting require highly integrated electronic assemblies with enhanced processing power and energy efficiency.
Additionally, the emergence of hypersonic weapons and autonomous defense systems has increased the demand for ultra-high-reliability microelectronics capable of operating under extreme conditions. The expansion of space exploration has further emphasized the need for microelectronics that can endure the harsh environments of deep space while maintaining performance and longevity.
Challenges
Military and aerospace applications require components that meet rigorous quality and reliability standards, including MIL-STD specifications, International Traffic in Arms Regulations (ITAR) regulations, and stringent environmental testing. Engineers must ensure that microelectronic assemblies maintain signal integrity in high-frequency applications, effectively dissipate heat in tightly packed electronic systems, and resist vibration, shock, and radiation exposure. Additionally, the long lifecycle of military programs demands that components remain functional and serviceable for decades, requiring specialized packaging solutions that prevent degradation over time.
Solutions
Promex offers cutting-edge microelectronics assembly and packaging solutions tailored to the unique requirements of the military and aerospace industries. With extensive experience in die-level assembly, wire bonding, and heterogeneous integration, we deliver high-reliability solutions that meet the demanding specifications of defense and aerospace applications. Our expertise in surface mount technology (SMT), thick film printing, and advanced semiconductor packaging enables us to produce ruggedized electronics that excel in extreme environments.
Our ISO 13485 and ISO 9001 compliant facility and cleanrooms ensure precision and quality control at every stage of manufacturing. By working closely with defense contractors, aerospace engineers, and government agencies, we develop customized solutions that accelerate development cycles, reduce production risks, and enhance the performance of mission-critical technologies.
Whether supporting avionics, satellite communication, missile guidance systems, or next-generation defense applications, Promex provides the expertise, advanced capabilities, and secure manufacturing processes needed to meet the evolving demands of military and aerospace innovation.
