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Articles, News & Press Releases from Promex.
A fully integrated cGMP manufacturer of FDA compliant Class II / III medical device and biotech assemblies located in the heart of Silicon Valley.
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Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
Browse Resources
Controlling Warpage In Advanced Packages
Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...
The Race To Glass Substrates
The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Dave Fromm, COO at...
Promex Broadens Leadership Team Expertise, Naming Matt Hansen Director of Sales and Business Development
Hansen to leverage breadth of industry experience in targeting new markets SANTA CLARA, Calif., May 15, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has named...
What Works Best For Chiplets
The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package...
The World’s Tiniest Computers, Medical Devices
With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production....
Silicon Photonics Manufacturing Ramps Up
Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed...
Choosing adhesives
Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...
Heterogenous integration packs big innovation into small medical devices
The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...
The Miniaturization Revolution in Electronics
In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...
Navigating Heat In Advanced Packaging
The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...
Powerful Sensors for the Eye
Advances in integrated microelectronics have enabled a revolution in ever smaller and more powerful medical sensors. One such use is for detecting pressure in the eye. InjectSense has invented an implantable sensor that detects direct dynamic pressure in the eye...
Heterogeneous Integration Finding Its Footing
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management...
Wirebonding Is Here To Stay
Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the...
Navigating thermally induced dynamics when developing miniaturized medical devices
Some complexities of integrating miniaturized components, such as microelectronics, into increasingly small medical devices are obvious. Examples include the precision required to position and align components with the requisite accuracy, or the...
Building Better Bridges In Advanced Packaging
The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what...
How to Build Better Medical Microelectronics
Advances in semiconductors, materials, power, and more are enabling electronics to miniaturize—including medical electronics. Design News asked Dave Fromm, Promex’s chief operating officer, a few questions about engineering microelectronics for medical devices....
Right Sizing Implantable Pressure Sensors
More uses for implantable sensors are being discovered every day. One such capability is pressure detection, including the detection of intra-ocular pressure, helpful for treating glaucoma. In this article for Medical Device & Diagnostic Industry, Promex's Dave...
Exploring the Intricacies of IC Packaging and Assembly Services
Dick Otte, CEO, and Rosie Medina, Vice President, Sales and Marketing, both at QP Technologies, discuss how the company helps its customers with a range of semiconductor technology solutions, covering wafer preparation, advanced assembly and design, IC packaging...
Promex Names David Fromm Chief Operating Officer
SANTA CLARA, Calif. (August 10, 2023) -- Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications markets, announced it has named David Fromm its chief operating officer. The...
Goals of Going Green
The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. In this Semiconductor Engineering article, Dick Otte, CEO of Promex, discussed how the company is working towards...
Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
In Part 1 of this series, we explored the history of medical innovations and how new approaches, like heterogeneous integration (HI), are poised to enable groundbreaking new treatments. Here, we will expand on the role of HI, as well as the assembly challenges for these devices and the importance of working with the right partner to successfully bring new medical devices to market.
Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
Heterogenous integration is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations of electronic, sensing, communication, and “effecting” devices.
Solving the Challenges of MEMS Device Assembly: Part Two
Once you have your MEMS device evaluated, your package chosen and your assembly process flow developed, it’s time to optimize your MEMS project flow. Optimizing your MEMS project flow is essential to achieving reduced costs with high yields. We’ll explore this aspect in part two, examining issues that typically impact a project and key considerations to help stave them off.
Solving the Challenges of MEMS Device Assembly: Part One
Microelectromechanical systems (MEMS) devices have become part of everyday life, as they are being incorporated into an increasingly wide range of applications, from smartphones to industrial instrumentation to medical devices to vehicles.
MEMS & Sensors Technical Congress 2022
Promex President & CEO Dick Otte will present on "Assembly Issues That Are Unique to MEMS Devices," at the 2022 MEMS & Sensors Technical Congress as part of Session 6—Packaging Process Showdown , April 27 at 1:15pm. Learn more About the MEMS & Sensors...
MD&M West 2022
Please join us at MD&M West! APRIL 12-14, 2022 Booth 2063 Anaheim Convention Center Book Time with Me Check out the...
A Conversation About Reshoring Advanced Packaging in the U.S.
A 55-minute audio discussion with the CEO of Promex, Dick OtteThe acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors...
Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
Industry Veteran Rosie Medina Appointed as VP of Sales and Marketingfor Promex Industries, Inc. Divisions Medina to lead sales and marketing activities for the company’sPromex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 –...
Heterogeneous Assembly Datasheet
Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a...
Tissue Marker Case Study
A short video looking at the fabrication issues for a small radio-frequency tissue marker used in oncology surgeries. Promex specializes in the assembly and fabrication of complex medical devices and biotech instruments and consumables involving customized assembly...
Endoscope Camera Assembly
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design. Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Wafer Singulation
A short video looking at how blade dicing remains the optimal solution for wafer singulation in most cases. Singulation is the process of dicing a silicon wafer into individual units and is a critical step in assembly and packaging. Dicing technology has continued...
Unique Assembly and Production Challenges
Here are some of unique assembly and production challenges we can solve: The smaller the better. We worked with the customer to design an optical Class 3 device that would be inserted into the human body. Requirements included Class 100 assembly and strict...
Advances in Medical Device Design
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design:Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Evolving Heterogeneous Integration Roadmap Highlights Trends
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Promex Awarded CA FDB Medical Device Manufacturing License
Microelectronics Assembly Technology Provider Exhibits June 25-27 at Sensors 2019 (Booth 1229) in San Jose, CA and at IMAPS Advanced SiP in Monterey, CA June 20, 2019 – Promex is now licensed to manufacture Class II and Class III medical devices by The State of...
Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
SANTA CLARA, Calif. – January 27, 2020 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced its participation in this week’s technical...
Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
Santa Clara, Calif. – PR NEWSWIRE May 30, 2018 — Promex, a provider of innovative IC packaging and heterogeneous assembly solutions for medical, biotech, and sensor-based microelectronic devices, announces that Promex Chief Technology Officer Annette Teng has been...
Promex Explores Disruptive New Generation of Flexible Hybrid Electronics
Electronics on Everything” may soon be more than just a promise with the advent of flexible hybrid electronics. FHE leverages the low cost of printed plastic film substrates and the performance of semiconductor devices to create a new category of electronics. What...
Promex CEO Richard Otte Presents at IEEE VLSI Test Symposium
The IEEE VLSI Test Symposium tapped Promex President and CEO Richard Otte for a presentation on the status, needs, and potential solutions for testing photonic devices and products. Held earlier this month in San Francisco, the symposium explored emerging trends...