Semiconductor Engineering
sat down with advanced packaging experts to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies; featuring: Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions.