Specializations

​At Promex, we specialize in solving your advanced packaging and assembly challenges on key subsystems for a broad range of applications in semiconductor, optical, photonics, diagnostics, life sciences, medical, and microelectromechanical systems (MEMS) devices, to name just a few.

Specializations

​At Promex, we specialize in solving your advanced packaging and assembly challenges on key subsystems for a broad range of applications in semiconductor, optical, photonics, diagnostics, life sciences, medical, and microelectromechanical systems (MEMS) devices, to name just a few.

​We create innovative process flows that integrate electrical and nonelectrical components into unique micro assemblies. Specifically, we’re skilled at heterogeneous integration of tiny components with unique functionality and complex, custom, or detailed assembly requirements. On these pages, you’ll learn more about our key areas of specialization and how we collaborate with you to deliver solutions that meet your unique project requirements.

Heterogeneous Integration

Heterogeneous Integration

Our proficiency in heterogeneous integration of small components with unique functionality using customized advanced packaging and assembly processes helps you meet your product development goals – from concept to commercialization.

We combine electronic and nonelectronic materials to bring your unique products to life and ensure a sustainable and robust path to market. We have over 100 years of combined engineering experience in multi-chip module, system-in-package and semiconductor assembly and package design.

Advanced Packaging

Advanced Packaging and Assembly

Advanced packaging and assembly are at the core of our service offerings. Flip chip, wire bond, BGA ball attach, system-in-package, multi-chip module, wafer prep/ backgrind and dice, automated die attach and lid seal are just a few of the processes we offer.

We provide a full range of packaging and assembly services – from surface-mount technology (SMT), wafer prep, and die bonding to wire bonding, encapsulation and finishing, and test and documentation. Whatever your packaging and assembly requirements, we can meet them.

Medical Devices

Medical and Biotech Products

Located in the heart of Silicon Valley, we are a fully integrated cGMP manufacturer of FDA-compliant Class II/III medical device and biotech assemblies.

We offer complex assembly services that are unique to your specialized medical device and biotech product requirements. From flow cell micro fluidic package creation to die surface reactive packaging solutions, we can solve your complex Heterogeneous Integration problems.

Heterogeneous Integration

Heterogeneous Integration

Our proficiency in heterogeneous integration of small components with unique functionality using customized advanced packaging and assembly processes helps you meet your product development goals – from concept to commercialization.

We combine electronic and nonelectronic materials to bring your unique products to life and ensure a sustainable and robust path to market. We have over 100 years of combined engineering experience in multi-chip module, system-in-package and semiconductor assembly and package design.

Advanced Packaging

Advanced Packaging and Assembly

Advanced packaging and assembly are at the core of our service offerings. Flip chip, wire bond, BGA ball attach, system-in-package, multi-chip module, wafer prep/ backgrind and dice, automated die attach and lid seal are just a few of the processes we offer.

We provide a full range of packaging and assembly services – from surface-mount technology (SMT), wafer prep, and die bonding to wire bonding, encapsulation and finishing, and test and documentation. Whatever your packaging and assembly requirements, we can meet them.

Medical Devices

Medical and Biotech Products

Located in the heart of Silicon Valley, we are a fully integrated cGMP manufacturer of FDA-compliant Class II/III medical device and biotech assemblies.

We offer complex assembly services that are unique to your specialized medical device and biotech product requirements. From flow cell micro fluidic package creation to die surface reactive packaging solutions, we can solve your complex Heterogeneous Integration problems.

Typical Clients

Intuitive Surgical
Illumina
Cepheid
Boston Scientific
St. Jude Medical
Paramit
Cianna Medical
Merit Medical
Teledyne Rad-Icon
Integrated Nano-Technologies
Incube Labs
SacraMed
Spinal Modulation
*These are examples of clients that Promex has worked with on various programs from startups to Fortune 500 companies. Due to confidentiality agreements were are not able to disclose actual customer names.

Getting Started

Concept to Commercialization

Whether you need short-run proof-of-concept prototypes, high-volume production, or a second-source manufacturer, Promex can help. Reach out to us and let's have a no-pressure conversation about how we might help advance your project to success.

  • How Can We Help?

    If you're working on a project where we could help, feel free to ask a question of one of our engineers or talk to someone on the business side.
  • Requested Services

    You can ask an engineer directly and avoid our sales staff until you're ready. Or you can send this message to someone on the business side.
  • This field is for validation purposes and should be left unchanged.