• Backgrind up to 12” wafers
  • Pre-saw die attach film application
  • Wafer saw including 300 mm (12”) wafers
  • Dual spindle saw capability
  • “Pizza” wafers and shuttle die processing
  • Die pick & place
  • Waffle packing
  • Die attach film
  • Custom thinning and sawing. AlN, glass, ceramic, etc.
  • Si, SiGe, GaN, InP
  • Controlled water resistivity