Things like complex devices with lower power consumption and increased connectivity. Combining components to fit into these smaller packages requires a series of assembly steps. With precise processes and skilled technicians to accurately locate and join components, control adhesive fillets seal joints to prevent liquid leakage, and more. You need the right equipment, processes and engineering skills. You need heterogenous assembly.

“Unique assemblies – especially those like SiPs that must provide not only electronic, but other functionality as well – require unconventional processes. If this is your challenge, we’ll find an innovative solution for you.”

It’s not easy to be heterogenous

You have to be a master at combing a wide variety of electronic and microelectronic assembly technologies like wafer backgrinding and sawing, multiple die attach processes, mechanical component attach, low temperature processes, overmolding, test, etc. And have advanced equipment for SMT, chip-on-board, flip-chip, sealing and more. Plus the skill to achieve accurate placement, high minimal voiding, adhesive flow control, etc. Perhaps that’s why we’re one of the few providers offering this service.

Redundant, fully automated, continuous flow assembly lines for continuous uninterrupted production

  • Highly-automated surface mount line with integrated SMT/PCBA for COB with component placement to 01005
  • Commercial and MIL-STD assembly flows
  • High speed chip shooter
  • Die inspection (MIL STD or Commercial)
  • Complex multi-die separation builds
  • Automated die attach (to less than 10 micron accuracy)
  • Die attach Film (conductive vs. non-conductive)
  • Ultra-fine pitch wirebonding (Au Ball, AI Wedge, Cu, RF-Au wedge)
  • Flip chip
  • Plastic over molding, encapsulation and precision materials dispense
  • Transfer mold
  • Dam & Fill
  • Laser Marking
  • Lead Trim & Forming
  • Lead Finishing