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Promex
  • Services
    • Process Engineering
    • Wafer Processing
    • Heterogeneous Assembly
    • Semiconductor Packaging
    • Quality
  • Applications
    • Medical Devices
    • Biotech
    • Automotive
    • Tech & Industrial
      • White Papers
      • Case Studies
  • About Us
    • Company
    • Leadership
    • Giving Back
  • Chip Package Drawings
  • Newsroom
    • News
    • Events
    • Media Coverage
    • Newsletters
  • Blog
  • Careers
  • Contact

Newsletters

To accelerate development and production of your complex devices, look no further than the Promex e-newsletter

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June/July 2018: CTO Annette Teng Honored by EPS, Design/Packaging/Assembly Services at ECTC, Air Cavity & Plastic Overmolded QFNs at IMS, Heterogenous Integration Needs Heterogeneous Package Assembly, Promex Exhibits at MEDInnovation Premiere, Custom Sensors Packaging & Assembly at Sensors Expo & Conference, New Brochure Waiting for You.


April/May 2018:  ISO Certifications Upgraded. New Sales Engineer Collen Ewanich. Expoloring Flexible Hybrid Electronics. Otte at IEEE VLSI Test Symposium. See us at Medical Electronics Symposium 5/16-17 in Dallas.

 

 


March 2018: $2 Million Heterogeneous Assembly Equipment Investment, SJSU Biomedical Device Conference Breaks Attendance Records, Quik-Pak takes QFNs on the Road


October 2017: New Website,  New Engineering Director Christian Walton and Quality Director Taren Nguyen, CTO Annette Teng Speaks about Miniaturization and High-Density Packaging at IEEE Event

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