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June 2019: New Director of Quality/Regulatory Compliance Hassan Sorkhabi. Promex CA FDB License = Rigorous Quality for Class II & III Med Device Manufacturing. See us at Sensors Expo (San Jose) & IMAPS SiP (Monterey).

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May 2, 2019: Quik-Pak exhibits open-cavity plastic packages (OmPPs) available in one day, open-molded/premolded air cavity plastic QFN/SOICs in five days or less at LISAT 2019. Promex provides advanced packaging with an engineering advantage for complex medical and biotech devices.

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April 2019: Promex explores new frontiers in biomedical engineering as sponsor of 10^th Annual SJSU Biomed Device Conference. Quik-Pak exhibi ts at IEEE Symposium for Microwave, Millimeter Wave & RF Engineers in Long Island.

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June/July 2018: CTO Annette Teng Honored by EPS, Design/Packaging/Assembly Services at ECTC, Air Cavity & Plastic Overmolded QFNs at IMS, Heterogenous Integration Needs Heterogeneous Package Assembly, Promex Exhibits at MEDInnovation Premiere, Custom Sensors Packaging & Assembly at Sensors Expo & Conference, New Brochure Waiting for You.

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April/May 2018:  ISO Certifications Upgraded. New Sales Engineer Collen Ewanich. Expoloring Flexible Hybrid Electronics. Otte at IEEE VLSI Test Symposium. See us at Medical Electronics Symposium 5/16-17 in Dallas.

 

 

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March 2018: $2 Million Heterogeneous Assembly Equipment Investment, SJSU Biomedical Device Conference Breaks Attendance Records, Quik-Pak takes QFNs on the Road

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October 2017: New Website,  New Engineering Director Christian Walton and Quality Director Taren Nguyen, CTO Annette Teng Speaks about Miniaturization and High-Density Packaging at IEEE Event