Evolving Heterogeneous Integration Roadmap Highlights Trends
by: Annette Teng, CTO, Promex/Quik-Pak
As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured components into higher-level assemblies such as systems-in-package (SiPs), offering higher bandwidth and functionality and lower power consumption in a small form factor. This … MORE >>