Promex/Quik-Pak Share Packaging and Assembly Capabilities for Next-Generation ICs at TowerJazz Technical Global Symposium and SMTA Silicon Valley Expo & Tech Forum
Promex Quik-Pak at IMAPS Booth 623 with Air Cavity Plastic and Overmolded QFNs, Assembly Services for Complex Medical and Biotech Devices
Promex Quik-Pak Features Air Cavity Plastic and Overmolded QFNs at Electronic Packaging Symposium, September 18-19, Binghamton, New York