That’s based on a conservative estimate of 200 sensors in each of the approximately 100 million new light vehicles expected to ship worldwide in 2020. OEMs are already capitalizing on opportunities for sensor development. Over the last five years, the demand for sensors has increased by $6 billion, with annual sales expected to reach $24.1 billion by 2018.

Sensors are employed in just about every function in and on a vehicle, including pressure, position, temperature and more. As manufacturers compete to make their vehicles smarter, safer and more efficient, advanced driver assistance systems, especially those based on LIDAR, are expected to be one of the largest drivers of sensor growth.

Advanced packaging helps OEMs meet cost/performance requirements

Semiconductor packaging technologies facilitate development of high-performance solutions. For example, one of Promex’s specialties is plastic encapsulation of MEMs and other sensors.

Encapsulation is a cost-effective process that allows the sensor surface to be partially exposed while protecting the embedded sensor and interconnections (wires) against destructive elements such as stress, hazardous gases and fluids. This functional packaging is highly versatile and compatible with technologies from exposed die molding to SiPs. Encapsulation also enables designer engineers to shape the package to the exact requirements of the application.

Promex facilitates advanced packaging with these on-site services:

  • Heterogeneous assembly in a Class 100 or Class 1000 cleanroom
  • Specialized sealing and encapsulation
  • Micron-tolerance optical component attach and precise diode placement
  • Geometry control for devices used in low-temperature applications (below 100º C)
  • Advanced process equipment, including Datacon EVO+, IConn K&S bonder, Disco 8” and 12” dual-spindle saws, Disco 12” backgrinder
  • ISO 13485 and ISO 9001 certified processes