That’s based on a conservative estimate of 200 sensors in each of the approximately 100 million new light vehicles expected to ship worldwide in 2020. OEMs are already capitalizing on opportunities for sensor development. Over the last five years, the demand for sensors has increased by $6 billion, with annual sales expected to reach $24.1 billion by 2018.
Sensors are employed in just about every function in and on a vehicle, including pressure, position, temperature and more. As manufacturers compete to make their vehicles smarter, safer and more efficient, advanced driver assistance systems, especially those based on LIDAR, are expected to be one of the largest drivers of sensor growth.
Semiconductor packaging technologies facilitate development of high-performance solutions. For example, one of Promex’s specialties is plastic encapsulation of MEMs and other sensors.
Encapsulation is a cost-effective process that allows the sensor surface to be partially exposed while protecting the embedded sensor and interconnections (wires) against destructive elements such as stress, hazardous gases and fluids. This functional packaging is highly versatile and compatible with technologies from exposed die molding to SiPs. Encapsulation also enables designer engineers to shape the package to the exact requirements of the application.