“Advances in Medical Device Package Manufacturing”  by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014. View PDF

Development Status of an OCCAM Electronic Assembly Method  by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014.  View PDF

“The QFN Platform — Chip Packaging Foundation”  by Promex CEO Richard F. Otte. Presented at the MEPTEC West Coast Luncheon, January 2014.  View PDF

A Simplified QFN Package Characterization Technique”  by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C and L vs frequency) of our family of overmolded QFN packages at RF frequencies up to 10’s of GHz. View PDF