News & Events

If someone asked you what your company does, could you sum it up in 20 words? We did. And we used it on the cover of our new corporate brochure: “We’re a ‘how to design, package & assemble complex medical & biotech devices’ company that puts a premium on service.” It’s not your typical brochure … MORE >>

  Santa Clara, Calif. – June 21, 2018 – Promex is exhibiting in Booth 103 at MedInnovation Boston 2018 on June 25 at the Westin Waltham Hotel in Boston, MA. Promex provides innovative IC packaging and heterogeneous assembly solutions for medical, biotech and sensor-based microelectronic devices. The company specializes in design, packaging and assembly services … MORE >>

  Santa Clara, Calif. – June 21, 2018 – Promex, a provider of innovative IC packaging and heterogeneous assembly solutions for medical, biotech and sensor-based microelectronic devices, is exhibiting in Booth 1526 at the Sensors Expo & Conference, June 26-28, at the McEnery Convention Center, San Jose, CA. Promex specializes in design, packaging and assembly … MORE >>

Santa Clara, CA – June 8, 2018 – Quik-Pak, a division of Promex providing innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic and Overmolded QFN Packages for RF/microwave, MEMS and sensor applications in Booth 809 at the IEEE MTT International Microwave Symposium (IMS), June 10-15, 2018 in Philadelphia, PA. … MORE >>

Meeting on June 12 at SEMI Headquarters, Milpitas CA

Santa Clara, Calif. – June 8, 2018 — Promex Chief Technology Officer Annette Teng will deliver a presentation on “Heterogeneous Integration Needs Heterogeneous Package Assembly” at the American Vacuum Society Northern California Chapter CMPUG/TFUG/PAG Joint Meeting on June 12 at SEMI Headquarters in Milpitas, California. Heterogeneous Integration refers to the integration of separately manufactured components … MORE >>

Promex Exhibits Design, Packaging and Assembly Services for Complex Medical and Biotech Devices in Booth 408 at ECTC in San Diego May 29 – June 1, 2018

Santa Clara, Calif. – PR NEWSWIRE May 30, 2018 — Promex, a provider of innovative IC packaging and heterogeneous assembly solutions for medical, biotech, and sensor-based microelectronic devices, announces that Promex Chief Technology Officer Annette Teng has been selected to receive the 2018 Electronics Packaging Society Regional Contributions Award for Regions 1-6, 7 and 9. … MORE >>