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Promex
  • Services
    • Process Engineering
    • Wafer Processing
    • Heterogeneous Assembly
    • Semiconductor Packaging
    • Quality
  • Applications
    • Medical Devices
    • Biotech
    • Automotive
    • Tech & Industrial
    • White Papers
    • Case Studies
  • About Us
    • Company
    • Leadership
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  • Chip Package Drawings
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News & Events

Media Contacts:

c3PR: Mar Junge mar@c3pr.com, 408-219-0101
Promex: rmedina@promex-ind.com, 408-496-0222

Promex and Quik-Pak Employees Donate Truckloads of Gifts to Toys R Tots

December 22, 2018

Promex and Quik-Pak joined tens of thousands of volunteers working with 800 community action programs across the US, in Puerto Rico and the Virgin Islands to donate toys to less-fortunate children. Promex VP of Administration Yvonne Esquer, organizer of the annual campaign, reports that employees surpassed last year’s generosity, with truckloads of gifts delivered to … MORE >>

Promex/Quik-Pak Share Packaging and Assembly Capabilities for Next-Generation ICs at TowerJazz Technical Global Symposium and SMTA Silicon Valley Expo & Tech Forum

November 30, 2018

Santa Clara, CA – November 30, 2018 –Promex and its Quik-Pak Division exhibited at two Silicon Valley events this month focused on the forthcoming fourth industrial revolution, also known as Industry 4.0. At the 13thannual U.S. Technical Global Symposium sponsored by global specialty foundry TowerJazz, and at the Silicon Valley Expo & Tech Forum sponsored … MORE >>

Promex Quik-Pak at IMAPS Booth 623 with Air Cavity Plastic and Overmolded QFNs, Assembly Services for Complex Medical and Biotech Devices

October 5, 2018

Santa Clara, CA – October 5, 2018 – Promex and its Quik-Pak Division will be at IMAPS in Booth 623 exhibiting air cavity plastic QFNs, overmolded QFNs, and assembly services for complex medical and biotech devices. The 51st International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) will be held … MORE >>

Promex Quik-Pak Features Air Cavity Plastic and Overmolded QFNs at Electronic Packaging Symposium, September 18-19, Binghamton, New York

August 27, 2018

Santa Clara, CA – August 27, 2018 – The Quik-Pak Division of Promex will exhibit air cavity plastic QFNs and overmolded QFNs at the 30th Annual Electronics Packaging Symposium (EPS), September 18-19, 2018 in Binghamton, New York. Considered by many the premier electronics manufacturing conference in the Northeast, the event’s format will give attendees ample … MORE >>

Five Shows, Two Honors, One New Brochure

July 13, 2018

June and July were busy months for Promex and our Quik-Pak Division. We exhibited at EPS, ECTC, IMS, MEDInnovation and the Sensors Expo & Conference. Promex CTO Annette Teng was honored by EPS for her significant and outstanding leadership. The American Vacuum Society invited us to speak about heterogeneous assembly at their Northern California Chapter … MORE >>

Check Out Our New Brochure

June 30, 2018

If someone asked you what your company does, could you sum it up in 20 words? We did. And we used it on the cover of our new corporate brochure: “We’re a ‘how to design, package & assemble complex medical & biotech devices’ company that puts a premium on service.” It’s not your typical brochure … MORE >>

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