Promex CTO Annette Teng Presents on Advanced Packaging Technology at American Vacuum Society Northern California Chapter CMPUG/TFUG/PAG Joint

Meeting on June 12 at SEMI Headquarters, Milpitas CA

AVS Science and Technology of Materials, Interfaces, and Processing

Santa Clara, Calif. – June 8, 2018 — Promex Chief Technology Officer Annette Teng will deliver a presentation on “Heterogeneous Integration Needs Heterogeneous Package Assembly” at the American Vacuum Society Northern California Chapter CMPUG/TFUG/PAG Joint Meeting on June 12 at SEMI Headquarters in Milpitas, California.

Heterogeneous Integration refers to the integration of separately manufactured components into a higher level assembly such as System-in-Package that, in the aggregate, provides enhanced functionality and improved operating characteristics. Increased functionality and miniaturization of devices need heterogenous assembly which requires innovative designs, processes and innovative materials on very small geometries. Dr. Teng will present some of the fundamental processes used by the electronics packaging industries to perform heterogenous assembly, including wafer thinning and singulation, die pick and vacuum assisted molding.

The American Vacuum Society Northern California Chapter CMPUG/TFUG/PAG Joint Meeting focuses on technologies and applications related to Advanced Packaging Technology. It will bring together leading researchers in academia, government, and industry with innovative technologies to nurture a free exchange of triumphs and challenges in packaging technology. The event runs from 12:00 – 5:00 pm at SEMI Headquarters, 673 South Milpitas Blvd.  Milpitas, CA 95035. Dr. Teng’s presentation is at 2:10.

Earlier this month, Dr. Teng received the Electronic Packaging Society Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth. October 2017 she was the featured speaker at an IEEE event on wafer thinning and singulation — a critical process for successful miniaturization and high-density packaging. Dr. Teng compared dicing yields and cost of various die singulation techniques, including stealth laser, laser ablation, plasma etch and conventional rotary blade. Her white paper on the various ways Die Attach Film (DAF) can be implemented for complex microelectronic assemblies can be downloaded from the Promex Knowledge Center.



Promex specializes in design, packaging and assembly services for a variety of applications including microelectronic subassemblies; Class II & III implantables and wearables; custom sensors and transducers; microfluidic, ultrasound and disposable devices; high-resolution imaging arrays; and camera and diagnostic equipment. Located in Silicon Valley since 1975, Promex provides design for manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wirebond, flip chip, overmolding and Class 100/Class 1000 cleanrooms. IC packaging, including overmolded QFNs, are available in five days from the Promex Quik-Pak Division in San Diego. Promex is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. For more information contact Promex Director of Sales and Marketing Rosie Medina at 1-408-496-0222, or visit the Promex website.