Promex Sponsors HIR Symposium to Embrace Innovations, Promote Collaboration, Accelerate Progress in Today’s Disruptive Digital Landscape
According to the five industry association sponsors of the Heterogeneous Integration Roadmap (HIR) Symposium,
“Heterogeneous Integration is and will be the key technology direction going forward. It is the “low hanging fruit” to initiate a new era of technological and scientific advances.”
Promex President and CEO Richard Otte agrees.
“Heterogeneous integration makes the design function much more complex than is typical for electronic products. This complexity can require more steps for the heterogeneous assembly of a single device or product. Sometimes as many as 50 steps,” he said.
For more about the challenges, read “Heterogeneous: It’s more than just Integration – it’s Assembly, too” by Mr. Otte published in the winter 2017 edition of the MEPTEC Report.
Richard Otte has more than 50 years of technical and executive electronics manufacturing experience. He is a member of IEEE, IMAPS and OSA and is involved in numerous industry roadmap activities with iNEMI, the IRDS Outside System Connectivity Subcommittee, the MIT Microphotonics Center Communications Technology Roadmap and the AIM Integrated Photonic Systems Roadmap (IPSR), where he chairs the Assembly Technical Working Group.