Promex Announces Production of Overmolded QFN Packages in San Diego by Quik-Pak Division

Quik-Pak Introduces New QFN Production at IMAPS 2017 in Booth 210, Oct. 10-11, Raleigh, NC

Santa Clara, CA – PR Newswire -October 10, 2017 – Promex, a provider of IC package development and heterogenous assembly services, announced the availability of overmolded QFN Packages produced onsite in San Diego, Calif. by its Quik-Pak Division. With a K&S IConn Plus wirebonder, molding press and laser marker onsite, the company now offers five-day delivery of assembled QFNs, with custom designs available in as little as five weeks after drawing approval. Quik-Pak will officially introduce its new production services in Booth 210 at the IMAPS 2017 International Symposium on Microelectronics in Raleigh, North Carolina, October 10-11, 2017.

“Expedited production of QFNs accelerates time to market for our customers. The faster they can get their packages back, the faster they can validate their package designs,” said Promex Director of Sales and Marketing Rosie Medina.

Quik-Pak’s overmolded, open-tooled QFN and DFN packages are available in over 35 designs, with multiple thicknesses. Package sizes range from 2×2 mm to 12×12 mm for QFNs and 1.5×1.5 mm to 4×4 mm for DFNs. All QFNs are RoHS compliant and utilize NiPdAu-plated lead frames. An independent third-party laboratory confirmed two of Quik-Pak’s overmolded packages produced on the new production line – a 4x4mm QFN24 and 6x6mm QFN48 – passed MSL3-level criteria for delamination and cracking per IPC/JEDEC-J-STD-020E.

“In addition to expediting packaging for quick-turn engineering builds, our San Diego production line offers an alternative to going offshore for high-volume production,” said Quik-Pak Global Sales and Marketing Director Casey Krawiec. “We’ve seen steady growth for die packaging in the QFN platform. It has become the package of choice for single die, multi-die, SiPs and stacked die.”

ABOUT QUIK-PAK

Quik-Pak provides IC packaging, assembly and wafer preparation services in its ISO 9001-certified, ITAR-registered facility in San Diego, California. The company’s overmolded QFN/DFN packages and premolded air cavity QFN packages provide a fast, convenient solution for prototype to full production. Both Quik-Pak and its parent company Promex are corporate premier members of IMAPS. Last year, Quik-Pak received IMAPS’ Corporate Recognition Award for “Significant Technical Contributions to the Microelectronics Industry.” More information is available at http://www.icproto.com and 1-858-674-4676.

ABOUT PROMEX

Promex specializes in innovative IC packaging and heterogeneous assembly solutions for medical device development, biotech microfluidic device design, and a wide range of automotive, semiconductor, industrial and commercial applications. Located in Silicon Valley since 1975, Promex provides onsite engineering development, RoHS-optimized SMT, wafer thinning, dicing, wirebond, flip chip, overmolding and Class 100/Class 1000 cleanrooms. The company is ISO 13485 and ISO 9001 certified and ITAR registered. More information is available at http://www.promex-ind.com and 1-408-496-0222.