Promex Showcases Microelectronic Device Development, Heterogenous Assembly at MEPTEC MEMS & Sensors Technology Symposium

Silver Sponsor of MEPTEC’s 15th Annual Event Finds Innovative IC Packaging and Assembly Solutions for Integrating Sensors into Medical, Biotech & Automotive Microelectronic Devices

Santa Clara, CA – PR Newswire June 6, 2017:  According to MEPTEC, the industry association for semiconductor packaging and test professionals, the use of MEMS-enabled sensors in mobility applications has increased by more than 1,000-fold over the last decade. This increase has resulted in significant new business opportunities for Promex, a provider of IC package development and heterogenous assembly services. The 35-year-old Silicon Valley-based company has a reputation for being able to achieve what other microelectronics assembly services providers can’t.

“It’s not unusual for a company developing complex devices for medical, biotech or automotive applications to come to us after other providers failed to find a solution to their IC packaging and assembly requirements,”  said Promex CEO and Founder Richard Otte.  “Our scientists and engineers have deep materials science and packaging expertise. And our production specialists know how to utilize our diverse on-site process and assembly capabilities. As a result, we can accelerate product development and facilitate a seamless transition to production.”

Promex is a silver sponsor of the 15th Annual MEMS & Sensors Technology Symposium being held on June 6, 2017 in San Jose, Calif. The company specializes in developing innovative solutions for integrating sensors into complex medical, biotech and automotive devices. Promex is known throughout Silicon Valley for its ability to meet requirements for development, documentation and delivery of complex microelectronics devices.

Promex’s Silicon Valley facility integrates RoHS-optimized SMT with semiconductor microelectronic packaging and assembly. In-house wafer thinning, dicing, wirebond, flip chip and overmolding services are supported by an engineering team with more than 35 years of experience. Fully controlled process flows ensure high reliability manufacturing. Promex offers Class 100 and 1000 cleanrooms, is ITAR registered and is ISO 13485:2003 and ISO 9001:2008 certified. More information is available at www.promex-ind.com or by calling 408-496-0222

Promex specializes in finding innovative IC packaging and heterogeneous assembly solutions for integrating sensors into medical, biotech and automotive microlectronic devices. Located in Silicon Valley, Promex integrates RoHS-optimized SMT with semiconductor microelectronic packaging and assembly. In-house wafer thinning, dicing, wirebond, flip chip and overmolding services are supported by an engineering team with more than 35 years of experience. Promex offers Class 100 and 1000 cleanrooms, is ITAR registered and is ISO 13485:2003 and ISO 9001:2008 certified.