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JEDEC standard and custom QFN/ TQFN / DFN plastic over molded, saw singulated packages. All QFN packages are RoHS compliant. Ink stamp or serialized laser marking. Copper wire bonding available. New JEDEC standard or custom package configuration lead time 4 to 5 weeks ARO. Promex is a recognized leader in developing and assembling QFN/ DFN’s for stacked die, thin molded, SiP (system-in-package) and MEMS devices. Quick turns through pre-Asia volume production. |
Plastic over Molded QFN, TQFN& DFN Packages |
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· RoHS compliant · JEDEC MO-220, MO-229 · NiPdAu plating standard · Saw singulated · Stacked die & SiP’s (2D, 3D, SMT versions) · Ink marking standard. Laser marking available. · Custom QFN packaging for MEMS devices · Copper wire bonding (1.0 mil & 0.8 mil)
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QFN/DFN for single, stacked die or SiP configurations |
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Silicon Valley’s Packaging Foundry |
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© copy & copyright Promex Industries, Inc. www.promex-ind.com 2010 |
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Promex QFN/ TQFN / DFN Plastic Molded Packages (all dimensions in millimeters)
Nom. height : QFN (0.9) TQFN (0.75) |
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size |
QFN leads |
DFN leads |
pitch |
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2x2 |
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6, 8,10 |
0.50 |
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2x3 |
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10,12 |
0.50 |
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3x3 |
8 |
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0.65 |
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3x3 |
12, 16 |
8, 10 |
0.50 |
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3x3 |
20 |
|
0.40 |
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4x3 |
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12 |
0.50 |
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4x4 |
16 |
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0.65 |
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4x4 |
20,24 |
12 |
0.5 |
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5x5 |
20 |
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0.65 |
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5x5 |
28, 32 |
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0.50 |
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5x5 |
36, 40 |
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0.40 |
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6x6 |
40 |
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0.50 |
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6x6 |
48 |
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0.40 |
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7x7 |
48 |
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0.50 |
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7x7 |
56 |
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0.40 |
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8x8 |
52, 56 |
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0.50 |
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8x8 |
68 |
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0.40 |
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9x9 |
64 |
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0.50 |
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10x10 |
72 |
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0.50 |
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12x12 |
100 |
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0.40 |