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JEDEC standard and custom QFN/ DFN / TQFN overmolded packages, saw singulated,  with NiPdAu plating finish standard.  Single, stacked die & SiP configurations.  Custom packages available within 5 weeks.   Access White Papers in our Knowledge Center for the QFN parasitics report .

 

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QFN / DFN / TQFN plastic overmolded package assembly

IC assembly using plastic overmolded leaded packages meeting Commercial or MIL-STD-883 for Si, GaAs and InP devices.

more plastic overmolded IC Assembly

IC assembly using the many commercially available ceramic packages.

Ceramic package IC assembly

BGA assembly, wafer sawing, die attach, wire bonding, encapsulation, COB, COF, other services

additional ic assembly services

Innovative Microbonds X-Wire™ allows wire bonding without concern of shorting due to wire contact after molding.

Microbonds x-wire™

Plastic overmolded packages outline and bond shell drawings available in pdf.

Access to package drawing downloads
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IC Assembly Services

To contact us call:

(1) 408.496.0222

Silicon Valley’s Packaging Foundry
8 HOUR QUICK TURNS THROUGH PRE-ASIA VOLUME PRODUCTION

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