About Us

About Us

Quick turns and Volume Production of QFN’s, Plastic and Ceramic IC Assembly

Promex provides responsive IC assembly and packaging options from quick turns through onshore volume production. Fully automated assembly capabilities ensure reliable and repeatable process control. Promex is S-2020 ESD compliant.

Rely upon Promex for your IC assembly and packaging needs:

* Wafer sawing including 300 mm wafers and shuttle die
* Automatic die attach (to less than 10 micron accuracy)
* Wire bonding (Au ball, Al wedge, and RF-Au wedge)
* Plastic over molding, encapsulation and precision materials dispense
* Complex multi-die separation builds
* Commercial and MIL-STD assembly flows
* Open Cavity Packages
* Class 100 & 1000 Cleanrooms
* Excellent ESD Control
* Quick Turns (8 hours from wafer to 100 QFNs!)

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