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Promex Showcases Heterogenous Assembly Services for Complex Devices, Quik-Pak Features Advanced Packages, in Booth 215 at ECTC, May 30-June 2, Lake Buena Vista, FL


Santa Clara, CA - May 2, 2017 - Promex will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 30 - June 2, 2017.


Promex's Silicon Valley facility features a seamless transition from engineering to production using data-driven, documentation-oriented processes. The company integrates RoHS-optimized SMT with semiconductor microelectronic packaging and assembly. In-house wafer thinning, dicing, wirebond, flip chip and overmolding services are supported by an engineering team with more than 35 years of experience. Fully controlled process flows ensure high reliability manufacturing. Promex offers Class 100 and 1000 clean rooms, is ITAR registered and ISO 13485:2003 and ISO 9001:2008 certified. More information is available at www.promex-ind.com or by calling 408-496-0222.


Quik-Pak's OmPPs and air cavity QFNs are available in off-the-shelf and custom configurations for prototype, mid volume and production volume requirements. OmPPs feature gold plating for wire bondability and thermal regulation, RoHS- and REACH-compliant green molding compound, short, highly conductive interconnects and JEDEC outlines with matching ceramic, plastic and glass lids. Quik-Pak also offers complete assembly services to help accelerate time to market, including flip chip and wire bonding (Au, AI and Cu from 0.6-20 mil diameters), wafer thinning, dicing, and pick and place. More information is available at www.icproto.com or by calling 858-674-4676.


ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. This international event brings together the best in packaging, components and microelectronic systems science, technology and education. It will feature advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF and emerging technologies.


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