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Promex Highlights Custom Design Processes, Microelectronics Assembly at 7th Annual Bay Area Biomedical Device Conference

EMS Specializing in Medical Device Development and Production Serves as Event Silver Sponsor to Demonstrate Support for SJSU Biomedical Engineering Society

Santa Clara, CA – March 30, 2016 – Promex will highlight its engineering and mixed technology contract electronic manufacturing services (EMS) at the 7th Annual Bay Area Biomedical Device Conference on March 30, 2016 at San Jose State University in San Jose, Calif. A silver sponsor of this annual event, Promex recognizes the importance of supporting the development of engineering talent. For 35 years the company has been known for the engineering expertise used to accelerate the design and production of biomedical products.

“As a Silicon Valley-based EMS focused on engineering, we are proud to support the SJSU Biomedical Engineering Society and commend it for organizing this forum for the world’s leading experts to discuss advances in medical device technologies and regulations,” said Promex Director of Sales and Marketing Rosie Medina.

Promex accelerates biomedical device time to market using mixed assembly processes on two duplicate RoHS-optimized SMT lines. Quality is assured by providing complete documentation packages with material traceability and packaging for shipment in containers that have been sealed in Class 100 and Class 1000 cleanrooms. Promex is experienced with IQ, OQ and PQ verification, with validations incorporating PFMEA methodology, and with FDA Title 21 Part 820 CFR compliance. A partnership-focused culture allows Promex customers the sequential steps of prototyping through volume production for:

• Class III devices utilizing long-life electronics that can be integrated into small, easily implantable modules
• Image sensors manufactured using processes that eliminate particle contamination (Promex can integrate sensors of different types into small assemblies, including optical assembly and precision placement of complex stacked assemblies)
• Diagnostic equipment requiring highly trained personnel with experience mounting small parts, including 0201 and 01005 SMT parts, micro BGAs and chip scale packages
• Disposable diagnostic devices that require a combination of electronics and sensors in a small, low-cost device

Promex also offers in-house wafer thinning, dicing, wirebond, flip chip surface mount and overmolding services at its 30,000-square-foot assembly facility in Silicon Valley. High-throughput, maximum-yield packaging solutions are available through its Quik-Pak Division in San Diego, Calif. Together, the two facilities are ITAR registered and ISO 13485:2003/ISO 9001:2008 certified. More information is available at www.promex-ind.com or by calling 408-496-0222.