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What We Do

  • -Proof of concept to production
  • -Custom engineered flows
  • -Materials science expertise
  • -Seamless transition from engineering to production
  • -35+ years of experience with a wide range of assembly processes
  • -Unique packaging solutions our specialty

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Medical Electronics

  • -Class lll, implantables, wearables
  • -Image and bioscience sensors
  • -Microfluidic, ultrasound and disposable devices
  • -Cameras and diagnostic equipment

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IC Assembly

  • -Air cavity plastic QFNs, overmolded plastic QFNs & DFNs
  • -Design, simulation & characterization
  • -Hermetic, plastic, COB
  • -Class 100 & 1000 cleanrooms
  • -Innovative packaging solutions for one-of-a-kind applications
  • -Supply chain management and turnkey procurement

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SMT

  • -Wafer thinning, dicing, wirebond, flip chip & overmolding
  • -RoHS-compliant and leaded solder systems
  • ->/= 01005 component placement
  • -IPC-A-610 Class 3
  • -ISO 13485:2003 & ISO 9001:2008 certified
  • -ITAR registered

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Knowledge Center

Company overview, white papers, technical bulletins, plastic package drawings, technical presentations

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Promex Showcases Microelectronic Device Development, Heterogenous Assembly at MEPTEC MEMS & Sensors Technology Symposium

Silver Sponsor of MEPTEC's 15th Annual Event Finds Innovative IC Packaging and Assembly Solutions for Integrating Sensors into Medical, Biotech & Automotive Microelectronic Devices

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